SJ/T 10668-1995 | 表面贴装技术术语Terminology for surface mount technology |
SJ/T 10670-1995 | 表面组装工艺通用技术要求General requirements for workmanship of surface mount technology |
SJ/T 10669-1995 | 表面组装元器件可焊性试验Solderability tests for surface mounted devices |
SJ/T 10666-1995 | 表面组装组件的焊点质量评定Quality assessment of soldered joints of SMA |
SJ/T XXXX-XXXX | 表面组装用胶粘剂通用规范(报批稿)General requirements for surface mounting adhesives |
SJ/T XXXX-XXXX | 锡铅膏状焊料(报批稿)Soldering paste |
SJ/T 10534-1994 | 波峰焊接技术要求Requirements for wave soldering |
SJ/T 10565-1994 | 印制板组装件装联要求Accepability technical requirements of printed board assembly |
SJ/T 10532-1994 | 工业管理Technological management |
SJ/T 10533-1994 | 电子设备制造防静电技术要求 |
SJ/T 10630-1995 | 电子元器件制造防静电技术要求 |
SJ/T 10694-1996 | 电子产品制造防静电系统测试方法 |