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[NOKIA公司内部资料]SMT工艺文件
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1.1 General shipping and storage conditions 2
1.2 Storage and handling conditions for solder paste 2
1.3 Storage conditions for underfill epoxy materials 3
1.4 Storage and handling conditions for printed wiring boards [PWBs] 4
1.5 Shelf life time for different component categories 5
1.6 Drying (baking) moisture sensitive devices 6
2. PASTE SPECIFICATIONS 7
3. STENCIL PRINTING PROCESS SPECIFICATIONS 8
3.1 Squeegee 8
3.2 Stencil 8
3.3 Support tables 9
3.4 Printing process parameters (stencil printing) 10
4. STATISTICAL PRINTING PROCESS CONTROL, SPPC 11
4.1 Alarm and control limit settings 11
4.2 Actions when the machine alarms 12
4.3 Handling of statistical process information 12
5. AUTOMATED OPTICAL INSPECTION, AOI 12
5.1 Location of the machine in the production line 12
5.2 Utilisation of inspection results 12
5.3 Component and paste alarm limits 12
6. REFLOW SOLDERING PROCESS SPECIFICATION 13
6.1 Profile measurement equipment 13
6.2 Reflow profile measurement method 13
6.3 Reflow profile specification 14
6.4 Recommended reflow oven settings 15
7. MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA 15
7.1 Manual and semi-automatic hot gas soldering and rework 15
7.2 Manual soldering and rework using soldering iron 16
7.3 CSP rework 16
7.4 Specifications for visual inspection; error criteria, faults classification and training material 17
8. UNDERFILL PROCESS 17
8.1 General 17
8.2 Dispencing pattern for CSP components 18
9. PLACEMENT PROCESS SPECIFICATIONS 19
9.1 Nozzles 19
9.2 Feeders 19
9.3 NC-Programs 19
9.4 Part Data / Vision processing 20
9.5 Placement process management data compatibility table 20