Table 3, J-STD-013 Projects - Work in Progress
Project Number	Assigned Number	Description of Activity	Status
P201	J-STD-031	Design standard for BGA applications	Working draft 10%
P202	J-STD-032	Performance standard for BGA bumps and columns	Working draft 95%
P207	IPC-2226	Design tandard for HDI PCBs	Working draft 40%
P208	IPC-6016	Qualification and performance specifiction for HDI layers or boards	Interim final
P209		Qualification and performance specifiction for BGA inorganic mounting structures	Not started
P210	IPC-TM-650	Test methods for qualification and evaluation of BGA mounting structures	Difined in HDI docs
P211	IPC-7075	Requirements for high-pin-count area-array component mounting	First proposal
P212	IPC-7095	Design and assembly process implementation for BGAs	Released
P213	Add to J-STD-029	Test methods for qualification and evaluation of BGA assemblies	Working draft 80%
P214	IPC-7711	Standard for BGA assembly rework and repair techniques	Published
P216	J-STD-004	Qualification and performance of flux used in BGA chip assembly (also IEC 61190-1-1)	Updating required

最好的还有待出台
　　一组专业献身的个人刚完成 IPC-7095, Design and Assembly Process Implementation for BGAs《BGA的设计与制造工艺实施标准》。在Ray Prasad 的领导下，来自 Celestica, Intel, Merix, Amkor, RadiSys, Tektronix, Micron 和 Glenbrook Technology 的专家开发了一个文件，确认所以实施BGA技术的要求。

　　IPC-7095描述了实施BGA和密间距BGA(FBGA)技术的设计与装配的挑战。也叙述了BGA和FBGA对现有技术和元件类型的影响。这个文件的重点在临界检查、修复和与BGA有联系的可靠性问题。

　　IPC-7095 的目标使用者是经理、设计与工艺工程师和从事电子装配、检查与修理过程的操作员和技术员。目的是为那些使用BGA或正考虑实施的人提供有用的和实际的信息。该文件提供了有关裸芯片怎样附着到板层的见解。图二和三显示了在BGA制造中使用的配线绑接(wiring-bonded)和倒装芯片的构造。

除了各种产品描述之外，IPC-7095 也提供了对BGA附着中空洞的信息与讨论。图四显示一个X光用来测定BGA球界面中的空洞的存在和尺寸。

　　更多的有关IPC7095的信息，请联系IPC的顾客服务部，电话：(847) 790-5362。行业应该感谢那些个人的辛勤工作和贡献，他们的名字列在每个标准的致谢页内。

DIETER BERGMAN, is director of technology transfer for the IPC -- Association Connecting Electronics Industries, 2215 Sanders Road, Northbrook, IL 60062; (847) 509-9700; Fax: (847) 509-9798.