定义标准化的要求
　　J-STD-012 和 -013 都不是传统的标准。每一个都促成什么标准需要开发来让下部结构(infractructure)去遵守的讨论。在早期，只有那些具有良好技术资源的公司才能供应得起对未证实的技术的投资。另外，行业内也都在实行外部采办，所以选错伙伴可能会损失惨重。
　　每一个 J 标准都定义一个发展计划。需要用于实施的标准被确认，并选择了范围和用途。对每个方案指定一个唯一编号，而不确定什么标准开发组织将担任领导角色。其结论可成为 J, IPC, EIA(Electronic Industries Alliance) 或 JEDEC(Joint Electronic Device Engineering Council) 的标准。
 

Table 3, J-STD-012 Projects - Work in Progress
Project Number	Assigned Number	Description of Activity	Status
P101	J-STD-026	Semiconductor design standard for flip chip application	Released
P102	J-STD-027	Mechnical outline standard for flip chip or chip scale configurations	Working draft 95%
P103	J-STD-028	Performance standard for flip chip/chip scale bumps	Released
P104	J-STD-029	Test methods for chip scale and BGA products and assembly	Working draft 95%
P105		Flip chip/chip scale carrier trays(JEDEC)	JC 11.5
P106		Bare dice as flip chip or chip scale configuration management standard(JEDEC)	JC 11.4
P107	IPC-2225	Design standard for single and multiple chip package printed boards	Released
P108	IPC-6015	Performace requirements for single and multiple chip package printed board structures	Released
P109	IPC-	Qualification and performance standard for flip chip inorganic mounting structures	Not started HM-840?
P110	IPC-TM-650	Test methods for qualification and evaluation of flip chip mounting structures	Defined in HDI docs
P111	IPC-7076 IPC-7078	Requirements for chip scale/chip size component package mounting Requirements for flip chip component package mounting(DCA)	Working draft First proposal
P112	IPC-	Standard for flip chip/chip scale assembly performance requirements	Not started
P113	Add to J-STD-029	Test methods for qualification and evaluation of flip chip/chip scale assemblies	Working draft 80%
P114	IPC-	Standard for flip chip/chip scale assembly rework and repair	Not started
P115	IPC-	Flip chip/chip scale assembly reliability standard	Not started
P116	J-STD-030	Qualification and performance of flip chip underfill materials	Proposal
P117		Qualification and performance of flip chip passivation materials	Not started
P118		Qualification and performance of flip chip encapsulation materials	Not started
P119		Qualification and performance for adhesives used in flip chip assembly	Not started
P120	J-STD-004

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